2015（中国）先进封装论坛已截止报名
推荐参加：2024先进功能材料及氮硼碳相关材料学术研讨会

会议时间： 2015-03-17 08:00至 2015-03-17 18:00结束

会议地点：上海详细地址会前通知周边酒店预订

主办单位：

行业热销热门关注看了又看换一换

会议通知

自从智能手机取代PC应用成为市场之主要驱动力，整个半导体产业便进入了所谓的移动时代。移动时代最主要的精髓就是沟通，人与人，人与装置或是装置与装置之间都需要沟通。

手持设备，可穿戴设备，车载单元，乃至于物联网真正在一个一个地进入视野，重新塑造我们的生活方式。有鉴于此，SEMICON CHINA 2015 “先进封装论坛”特邀产业精英们，共同探讨移动时代的封装技术及解决方案。从市场趋势分析道产品应用，搭配多元的封装技术，创新的设备材料，以及完善的测试与可靠性分析方法，畅想封装产业新蓝图。

会议主题：

1、Market Analysis of Advanced Packaging；
2、Approaches Overview of Advanced Packaging Technologies；
3、New Materials in Advanced Packaging Integration；
4、Testing of Advanced Packaging Integration；
5、Modeling of Advanced Packaging Integration；
6、Roadmap Discussion of Advanced Packaging in China；
7、Challenges of Advanced Packaging Development in China；

SEMECON China 2015同期活动一览：

会议日程（最终日程以会议现场为准）

2014年先进封装技术论坛议程：

Agenda	先进封装技术论坛（ Advanced Packaging Technology Forum）
Moderator	Dr. Yifan Guo, Vice President of Engineering, ASE Shanghai

13:00 - 13:10	Opening Remark
	Tom Salmon, Vice President, Global Member Services & Standards, SEMI

13:10 – 13:40	The evolvement of IC & packaging
	Dr. Ed Chang, Director, China Business Development, TSMC

13:40 – 14:10	3D Integration Opportunities and Plating Challenges
	Dr. Zhenqiu Liu, Director of Wet Process Engineering, TEL, USA

14:10 – 14:40	New Opportunity of Advanced Packaging Process Equipment
	Peijun Ding，Vice president, Beijing NMC Co.,Ltd.

14:40 – 15:10	Advanced CSP & Turnkey Solutions
	Fumio Ohyama, Deputy Chief Sales Officer, Tera Probe

15:10 – 15:40	Innovative Advanced Package Solutions for Mobile Application
	Chang-Yi (Albert) Lan，Senior Director, SPIL

15:40 – 16:10	3D-IC beyond smartphones
	Gregory Smith,General Manager, Computing & Communications Business Unit, Teradyne

16:10 – 16:40	Panel Level Packaging Technologies as Enabler for Innovative Mobile Devices
	Rolf Aschenbrenner,IEEE Fellow / Deputy Director, Fraunhofer IZM

16:40 – 16:50	Closing and lucky draw (Huawei P6S Smart Phone)

	*议程变化请以网站为准（Please note, the agenda is tentative and subject to change.）