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2016电气工程,机械工程与自动化国际会议
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2016电气工程,机械工程与自动化国际会议

会议时间:2016-04-25 08:00:00至 2016-04-26 18:00:00结束

会议地点:杭州   

会议规模:暂无

发票类型: 增值税普通发票 增值税专用发票
推荐参加:2017第二届机械与电气工程大会(WCMEE2017) (时间:2017-10-25 地点:上海 )

门票名称单价截止时间数量

参会人信息







会议通知


会议介绍

2016电气工程,机械工程与自动化国际会议为广大电气工程、机械工程与自动化等相关领域的学者、专家提供交流平台。会议组委会诚邀全球相关领域的学者、专家参加此次国际会议,就电气工程、机械工程与自动化相关热点问题进行探讨、交流,共同促进全球工程科学的发展。

2016电气工程,机械工程与自动化国际会议将于2016年4月25-26日在中国杭州召开。杭州是浙江省的省会,中国七大古都之一。意大利旅行家马可•波罗曾在他的游记中惊叹:杭州是世界上最美丽华贵的天城。杭州西湖位于杭州市西面,它以其秀丽的湖光山色和众多的名胜古迹而闻名中外,是中国著名的旅游胜地,被誉为“人间天堂”。此外,杭州也以“中国茶都”和 “丝绸之府”著称。2022亚运会将在杭州举办,这让杭州成为中国第三个荣获亚运会举办权的城市。同时,中国最大的网络公司和世界第二大网络公司——阿里巴巴的总部,也坐落于杭州。

类别:电气工程,机械工程,自动化

会议名称:2016电气工程,机械工程与自动化国际会议

会议时间:2016年4月25-26日

会议地点:中国,杭州

会议范围包括但不限于以下主题:

电气工程 动力、系统控制、电力技术、电磁学、微电子、信号处理、电讯、电力系统与自动化、电机与电器、光子学与光学、高电压与绝缘技术等。

机械工程 机械学、生物力学、纳米技术、结构分析、设计与制图、声学工程、机电一体化和机器人、计算流体动力学、热力学和热学等。

自动化 机械制造自动化、离散控制、计算机控制、自动采矿、家庭自动化、连续控制、工业自动化、自动公路系统、自动视频监控、自动废物管理等。

主办方:上海来溪会务服务有限公司

会议日程


欢迎参加2016电气工程,机械工程与自动化国际会议(ICEEMEA2016),ICEEMEA2016将于2016年4月25-26日在中国杭州召开。以下是会议日程信息,供您参考:
(具体日程安排会根据实际情况有所调整)

会议日程

4月24日

11:00-17:00

报到

4月25日

09:00-12:00

特邀嘉宾演讲

12:00-14:00

午餐

14:00-17:30

口头报告

18:30-20:00

晚宴

4月26日

08:00-18:00

杭州一日游,缴费的参会者在会后可享受免费旅游,预计旅游景点包括西湖,雷峰塔,灵隐寺,龙井村等。

会议嘉宾


2016电气工程,机械工程与自动化国际会议

He Yunbo, Professor

Faculty of Electro-Mechanical Engineering, Guangdong University of Technology, Guangzhou, China

Biography: He Yunbo, male, PhD, Professor of MOE Key Laboratory of Electronic Manufacturing Equipment, Guangdong University of Technology. Research fields: motion control, semiconductor packaging equipment, industrial SCARA robots, automation and machine intelligence. Work experience: 2015 - Now, Professor of Guangdong University of Technology; 2010-2014, Hans Photoelectronic Equipment co. Ltd.; 2002-2010, ASM Technology Singapore; 2000-2002, Post Doctoral Fellow of Nanyang Technological Unviersity Singapore; 2000, Huawei Technologies Ltd.; 1995 - 2000, PhD research, Xi'an Jiaotong Unviersity.

Topic: Intelligent Fine Tuning of Motion Control Systems on High-End Semiconductor Back-end Equipment

Abstract: It’s always difficult to satisfy both strict requirements of dynamic performance and settling performance of high-precision and high-acceleration point-to-point motions on electronic packaging equipment, i.e., Die bonders, Wire bonders, Flip-chip bonders, Wafer bumping machines, and so on. Focusing on this difficulty, Fuzzy logic is promoted in this paper to fine tune feed forward coefficient parameters of motion systems on packaging equipment to satisfy multiple targets of dynamic and settling performance requirements. An intelligent approach is promoted in this paper to fine tune parameters to satisfy multiple targets of dynamic and settling performance requirements. This intelligent fine tuning approach, with achievable multiple motion targets, provides a solution to optimize motion system performance on bonding machines, so as to further improve bonding performance. The idea proposed in this paper helps on development and smooth mass production of semiconductor packaging equipment.

2016电气工程,机械工程与自动化国际会议

Rey-Chue Hwang, Professor

Electrical Engineering Department, I-Shou University, Kaohsiung City, Taiwan, R.O.C.

Biography: Professor Rey-Chue Hwang received his Ph.D. degree in electrical engineering from Southern Methodist University, Dallas, Texas, U.S.A. in year 1993. Then, he joined the Department of Electrical Engineering, I-Shou University (ISU), Kaohsiung, Taiwan, as a faculty. Currently, he is a full professor.

Professor Hwang has published over 250 papers in various technical journals and conferences in the areas of artificial intelligent system, signal processing and fuzzy control. Throughout his professional career, he had served as the Chairman of Electrical Engineering Department, ISU (08/1996~07/1999), the Director of General Education Center of ISU (08/2007~07/2014), the interim Dean of International College of ISU (08/2011~07/2012), the vice director of general affairs of Chinese Institute of Electrical Engineering, Kaohsiung Division (08/1999~07/2001), the councilor of Chinese Fuzzy Association (02/2004~07/2006), the patent referee of Intellectual Property Office, Taiwan (2005~2007), and the research project referee of National Science Council, Taiwan (2005~present). He is a Fellow of Institution of Engineering and Technology (IET, 2010) and a senior member of Institute of Electrical and Electronics Engineers (IEEE). In year 2004, he chartered IEEE Computational Intelligence Society (CIS) Chapter, Tainan Section and served as the co-chair and chair from year 2004 to year 2009. Furthermore, he has also served the reviewer and the program/technical committee for various international journals and conferences.

Professor Hwang also was the vice president of the General Education Association of Southern Taiwan Colleges (08/2010~07/2013). Currently, he is severing as the Evaluation Committee of the Higher Education Evaluation and Accreditation Council of Taiwan.

Topic: The Novel Indoor Positioning Method by Using Neural Network Technique

Abstract: Indoor positioning system (IPS) has become more and more popular in the object searching due to the rapid developments of wireless communication technique and personal network. IPS is used to provide the location information of person or device. It is a system of location based service (LBS) through the integration of the wireless communication and information services. The object’s accurate position could be determined by using IPS. It has been used widely in the various applications, such as cargo management, patient monitoring, public guiding system, etc. Undoubtedly, IPS will certainly play a significant role for the smart life of human beings in the future. Generally, the structure of IPS could be divided into two parts, i.e. the positioning algorithm and the sensing infrastructure. In this talk, a novel IPS computational algorithm based on neural network will be presented for showing its good positioning ability

会议门票


欢迎参加2016电气工程,机械工程与自动化国际会议(ICEEMEA2016),关于参会费用,请参见以下信息。原则上一篇论文至少要有一名作者参会。所有参会人员参会前均需在线注册。

参会费用(作者)

票务类别

包含内容

录用通知15天内缴费

录用通知16-25天内缴费

录用通知25天后缴费

A票

参会+版面费+会议资料
+礼品+旅游

1800元

2000元

2200元

B票

参会+版面费+会议资料
+礼品+旅游
+午餐+欢迎晚宴

2200元

2400元

2600元

C票

参会+版面费+会议资料
+礼品+旅游
+午餐+欢迎晚宴
+酒店住宿(两晚)

3400元

3600元

3800元

参会费用(只参会不投稿人员)

票务类别

包含内容

2016年4月5日前缴费

2016年4月5日后缴费及现场缴费

D票

参会+会议资料+礼品+旅游

1000元

1200元

E票

参会+会议资料+礼品+旅游
+午餐+欢迎晚宴

1400元

1600元

F票

参会+会议资料+礼品+旅游
+午餐+欢迎晚宴
+酒店住宿(两晚)

2600元

2800元

G票

参会

免费

免费

:只参会不投稿人员可在会议中做口头报告,注册费用在以上票价(D票、E票、F票)基础上增加500元(口头报告的主题、摘要等信息将会收录在程序手册中)。

参会费用所含内容说明:

1、参会:听取会议主会场报告及分会场报告;
2、版面费:一篇论文的出版费用(A、B、C票);
3、酒店住宿(包含早餐):酒店住宿两晚(仅C票和F票),会议预计在四星级或五星级酒店举行,预计酒店住宿协议价为600元/晚;
4、午餐和欢迎晚宴:会议期间的午餐及欢迎晚宴(仅B、C、E、F票;A票、D票和G票需参会者自理餐费;如需现场购
买,标准为:午餐150元,晚宴 200元);
5、会议资料:胸牌, 程序手册,纸质期刊一本(作者文章所发表的一期的纸质版,国内邮寄免费,国外邮寄需加收邮费)等;
6、礼品:会议精美纪念礼品一份;
7、旅游:杭州一日游,缴费的参会者在会后可享受免费旅游,预计旅游景点包括西湖,雷峰塔,灵隐寺,龙井村等
(如不参加旅游,无退费)。

其他说明:

1、团体购票6张及以上可享9折优惠;
2、团体购票10张及以上可享8折优惠;
3、同一作者(第一作者相同)第二篇文章优惠200元。

会议场地:

标签: 机械工程 电气工程 自动化 机械加工

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