会议介绍
2019年智能芯片设计与半导体电路国际会议(ICDSC 2019)将于2019年1月5-7日在三亚举行。智能芯片领域的国际竞争已经愈发激烈,高端智能芯片产业即将成为全球争夺半导体产业主导权的契机。此次大会将特邀国内外智能芯片与半导体电路领域内的学者专家前来参会,深度探讨智能芯片、智能传感器、半导体集成电路、深度学习平台等当前技术热点和行业发展前沿。
温馨提示:
大会官方语言是英语,现场无同声传译。
AI ChipDesign
Analog and mixed-signal circuits
Analog signal processing
Chip-to-chip communications
Circuit technologies
Circuits/devices modeling, verification and testing
Data converters and Data storage
Digital architectures and systems
Digital integrated circuits
Digital/synthesizable voltage regulators and plls
Emerging ic and system
Energy harvesting circuits and systems
Hardware-security circuits
High-bandwidth i/o interfaces
Image sensors and companion chips
Intra-chip communication circuits
Intelligent Chip
Memory design and Memory/ssd controllers
Memory-subsystem enhancements
Mems-based integrated systems
Micro-controllers and Microprocessors
Nano electronics circuits
Power control and management
Processing-in-memory
Processors/ multiprocessors
Reconfigurable architectures & FPGA-based designs
RF integrated circuits and microwave engineering
Sensor interface circuits
Special-purpose digital circuits
Subthreshold and near-threshold circuits
Switched-mode power supplies
System-level power management
Ultrasonic sensors, neural interfaces and closed-loop systems
Wide-bandgap-semiconductor
Wireless sensing, radar and localization
| 详细版日程将在会前一个月左右发布,并通知所有作者。简版日程如下: | |||
| 1月5日 | 1月6日 | 1月7日 | |
| 8:30-10:00 | 特邀专家报告 | 口头报告 | |
| 10:00-10:20 | 茶歇 | 茶歇 | |
| 10:20-12:00 | 特邀专家报告 | 口头报告 | |
| 14:00-16:00 | 注册 | 特邀专家报告 | |
| 16:00-16:20 | 茶歇 | ||
| 16:20-18:00 | 特邀专家报告 | ||
参会价格
Package A:仅参会(无报告)USD 400 (RMB 2400)
参会费包含内容:
1. 可参加所有会场
2. 会议期间午餐(1月6,7日)
3. 会议期间晚餐(1月6日晚)
4. 会议期间茶歇
5. 会议指南及会议期刊各一本

